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As a Process Integration Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

• Develop2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/Re-Distribution Layer,Through-Silicon Via, Backside Via Reveal,Hybrid Bonding

• Plan wafer splits/ lot run with design of experiment methodologyfor co-optimization of unit process to enable overall successful integrated module development.

• Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.

• Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.

• Owns, manage,and drive technical programs/ project, report out timely status andinterface with various stakeholders/management leading to completion.

   

Experiences:

• Seniorengineer level position: Minimum 5 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packagingor Assembly.

• Entry level position: new colleague graduateis welcome.

• Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer,Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.

• Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.)will be advantageous.

• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.

• Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.

• Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners andgeographies to achieve technical outcome.

• Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.

Work Location:

• Science Park II

Qualifications

Education:

Bachelor's Degree

Skills:

Certifications:

Languages:

Years of Experience:

4 - 7 Years

Work Experience:

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Not Specified

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.